High-Density Interconnect (HDI) PCB
Design & Capabilities

High-Density Interconnect (HDI) PCB

HDI PCB boards, one of the fastest growing technologies in the PCB industry. This types of PCB contain both the blind via and buried via hole varieties and have a higher circuitry density than traditional circuit boards. Hiberxen Electronics produces high quality HDI PCB with reliability.

HDI PCB stands for High-Density Interconnect Printed Circuit Board. These PCBs having relatively high circuit density that uses micro-blind and buried “via” or the copper-plated holes in PCB technology. These PCBs are compact product designed for small-capacity users, as they cost much more than standard PCB.

HDI PCB Advantages
HDI technology can reduce the ultimate cost of PCB.

  • The traditional and complex pressing process is low.
  • Increased circuit density: traditional circuit boards and parts are interconnected.
  • Conducive to the use of advanced construction technology.
  • Have better electrical performance and signal accuracy.
  • Better reliability.
  • Can improve thermal properties.
  • Can improve radio frequency interference/electromagnetic wave interference/electrostatic discharge (RFI/EMI/ESD).
  • Greater design efficiency.t

Types of HDI PCB

HDI PCB comes in different types with same functions. The type you decide to choose depends on the application you are using. Following are the different types of HDI PCBs.

    • Rigid HDI PCB:
      HDI PCBs are made of a solid and rigid substrate material such as fiberglass. This kind of material prevents the bending of the HDI board. The application of this HDI PCB can be found on towers of most desktops.
    • Rigid-Flex HDI PCB:
      This is made of a rigid circuit board, which attaches to a flexible board. The design’s complexity depends on whatever application you are using.
    • Flex HDI PCB:
      Flex HDI PCB is composed of flexible plastic. This material permits the board to form different shapes. This offers lots of benefits when compared with rigid boards. The board’s flexibility also allows you to move or bend easily during the process of application without bringing damage to the circuits that are present on the board. One disadvantage with this board type is that designing and manufacturing it costs a lot. However, they come with numerous benefits. The heavy wiring found in advanced equipment like satellites can be replaced with flexible HDI PCBs. They are lighter and make use of little space, making them great for such use. Another benefit is that it features different designs like multilayer, single-sided, or double-sided designs.
    • Multilayer HDI PCB:
      These boards have substrate boards of multiple layers with an insulating material that separates these layers. Just like HDI PCBs with double sides, either vias or through holes can be used in connecting the board’s electric circuits. Multilayer HDI PCBs are very beneficial because they use less space. Standard applications using this HDI board type include medical machinery, servers, handheld devices, and computers.

Rigid-Flex PCB Capabilities

Item Description Remark
Layer 1- 32 Layers (FR- 4, FR- 406, 370 HR)
1- 2 Layers (Rogers, TEFLON)
 
Material FR- 4, FR- 406, 370 HR; Rogers4003; Rogers4350
TEFLON
 
Finish Thickness Finish Thickness: 0.008″ – 0.275″ (0.2mm- 7mm)  
Min Thickness 2- layer: 0.008″ (0.2mm)
4- layer: 0.016″ (0.4mm)
6- layer: 0.024″ (0.6mm)
8- layer: 0.032″ (0.8mm)
10- layer: 0.04″ (1mm)
More than 10layers (0.5Xnumber of layers X0.008″)
 
Surface Finishing Lead Finishing: HASL, HASL + Gold finger
Lead- free Finishing: Lead- free HASL, ENG Gold; OSP, Immersion Silver
 
Special Process Impedance board (request as±10%)
High TG / Halogen- free/ Halogen- free & High TG board
 
Min Trace
Width / Min Clearance

Inner Layers (trace width/clearance)

0.5oz: 2.5/ 2.5mil

1oz: 3/ 3mil

2oz: 5/ 7mil

3oz: 7/ 8mil

4oz: 10/ 10mil

5oz: 12/ 12mil

6oz: 15/ 12mil

Outer Layers (trace width/clearance)

1/ 3oz- Haz: 3/ 3mil

1oz: 3.5/ 3.5mil

2oz: 5/ 7mil

3oz: 7/ 8mil

4oz: 10/ 10mil

5oz: 12/ 12mil

6oz: 15/ 12mil

 
Aspect Ratio Min Hole Size 6mil  
Min Hole Ring

Inner:

0.5oz: 4mil

1oz: 5mil

2oz: 6mil

3oz: 9mil

4oz: 12mil

5oz: 15mil

6oz: 17mil

Outer:

1/ 3oz -0.5oz: 4mil

1oz: 4mil

2oz: 6mil

3oz: 9mil

4oz: 12mil

5oz: 15mil

6oz: 17mil

 
Copper Thickness Inner: H0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz. 6oz
Outer: 1/ 3oz, 0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz
 
Min Hole Size and Tolerance Min Finish Hole: 6mil
Hole Tolerance: ±3mil
 
Thickness of Plating Layer

·         HASL: Copper Thickness: 20um -35um Tin 5 -20um

·         Immersion Gold: Nickel 100u” -200 u” Gold 2u” -4u”

·         Hard Plated Gold: Nickel 100u” -200 u” Gold 4u” -8u”

·         Golden Finger: Nickel : 100u” -200 u” Gold : 5u” -15u”

·         Immersion Silver: 6u” -12u”

·         OSP: Film 8u” -20u”

 
Solder Mask Color

Glossy : Green, Black, Red, Yellow, White, Purple, Blue

Matt : Green, Black

 
Solder Mask Resolution

Solder Mask Thickness : 0.2mil -1.6mil

Solder Dam : Green 7mil /Other Color 8mil

Solder Mask Hole Plug Diameter : 10mil -25mil

 
Silk Screen Color White, Black  
Profile

Punch Tol: ±5mil

CNC Tol: ±5mil

V- CUT Tol: ±10mil

Bevel Edge: ±5mil

Slot Min: 32mil

Angel: 15°, 20°, 30°, 45°, 60°

 
Bow and Twist SMT≤0.75%
None SMT≤1%
 
Accept Standard IPC Class 2; IPC Class 3; ISO9000  

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