Most products today require special attention to signal integrity. HIBERXEN offers customers a large variety of base materials to cover their needs in the high speed/low loss arena. In addition, we can assist our customers with various advanced high frequency measurement techniques to verify compliance to specifications. We have had the opportunity to manufacture Hybrid PCB prototypes for communications, defense, satellite and aerospace products.

High frequency PCB or RF PCBs are multilayer printed circuit board with dissimilar material for each layer. This type of PCBs are usually developed to optimize electrical performance of the system where PCB will be installed. Using correct combination of substrates leads to improvement in the reliability of PCB. Different substrate materials with different dielectric, different thermal expansion coefficient, different radio frequency improve the electrical performance of the PCB.

There are various manufacturers of laminates including Rogers, Arlon, Taconic, Nelco, Panasonic and ISOLA. We have experience of fabrication with various combinations of laminates to serve wide range of High Frequency PCB designs for customers. We typically use FR-4 material and PTFE laminates which allows the design engineer to boost high frequency performance while at the same time reduce the footprint of the board and the cost.

RF PCB standard：

• Low power RF PCB mainly uses standard FR4 material that have good insulation properties, uniform material, dielectric constant ε=4, 10%.
• In RF PCB design, each component should be closely arranged to ensure the shortest connection.
• For a mixed-signal PCB, the RF and analog parts should be far away from the digital part, the distance is usually more than 2cm or at least 1cm, and the ground of the digital part should be separated from the RF part.
• When selecting components to work in a high-frequency environment, use SMD as much as possible. SMD are small in size and the component pins are generally very short.