Flexible PCB Design & Capabilities

Flexible PCB

Flexible PCBs offers physical and electrical interconnect solutions that cannot be achieved with rigid PCB. Hiberxen offers a comprehensive range of Flexible PCB manufacturing and PCB assembly.

A Flexible PCB having a base material composed of polyester resin or polyimide resin. It can be variously bent and folded according to the manufacturing needs of any particular application.

The basic portion of Flexible PCB is a film, which is used to support circuits composed of copper pieces. The various flexible PCB manufacturing process properties belonging to a flexible PCB include: lite, softness, thinness, flexibility and high-wiring density.

Accordingly, the flexible PCB offers design freedom in electronic equipment and in particular, saves an amount of wasted space, thereby downsizing the equipment.

Flexible PCB Types

Flexible PCB applications typically include designs where the PCB wraps around other electrical subsystems against the inside of an applications enclosure. Consequently, the material options commonly available for these purposes have specific mechanical, thermal and chemical properties. It is possible to adapt this layer depending on the desired performances, mechanical strength, temperature resistance, bending. we offer rigid PCBs in a range of types, including:

    • Single-layer flexible PCB:
      One conductive copper layer bonded between two insulating polyimide layers
      Example construction: cover-lay/copper/flex core.
    • Double-layer flexible PCB:
      Two conductive copper layers with an insulating polyimide between and external polyimide insulating layers. Plated through-holes provide circuit connection between layers.
      Example construction: Cover-lay/copper/flex core/copper/cover-lay.
    • Multi-layer flexible PCB:
      Three or more up to 8 flexible conductive layers with flexible insulating layers between each one and external polyimide insulating layers
      Plated through-holes provide circuit connection between layers.
      Example construction: Cover-lay/copper/flex-core/copper/adhesive/flex-core/copper/cover-lay.

    Flex Core Materials:
    Standard thicknesses: 1/2 mil to 3 mil in either adhesive or adhesiveless constructions.
    Standard copper thicknesses: 1/3 oz to 2 oz in rolled annealed or electro deposited formats.
    Cover-lays:
    Standard thickness: 1/2 mil to 2 mil polyimide, with 1/2 mil to 2 mil epoxy or acrylic adhesive
    Stiffeners:
    Component support or ZIF connector thickness requirements
    Materials: polyimide, FR4, stainless steel, aluminum.
    PSA (pressure sensitive adhesives) available for attachment purposes.
    EMI/RF shielding films available.

Flex PCB Capabilities

ItemDescriptionRemark
LayerFlex board : 1 – 8 Layers 
MaterialPI, PET, PEN, FR-4 
Final ThicknessFlex board : 0.002″ – 0.1″ (0.05 – 2.5mm) 
Surface TreatmentLead-free : ENG Gold, OSP, Immersion silver, Immersion Tin 
Max / Min Board SizeMin : 0.2″x0.3″ Max : 20.5″x13″ 
Min Trace Width / Min Clearance

Inner :

0.5oz: 4/4mil

1oz: 5/5mil

2oz: 5/7mil

Outer :

1/3oz-0.5oz: 4/4mil

1oz: 5/5mil

2oz: 5/7mi

 
Min Hole Ring

Inner :

0.5oz: 4mil

1oz: 5mil

2oz: 7mil

Outer :

1/3oz-0.5oz: 4mil

1oz: 5mil

2oz: 7mil

 
Copper Thickness1 / 3oz – 2oz 
Max / Min Insulation Thickness2mil / 0.5mil (50um / 12.7um) 
Min Hole Size and ToleranceMin hole : 8mil
Tolerance : PTH±3mil, NPTH±2mil
 
Min Slot24mil x 35mil (0.6×0.9mm) 
Solder Mask Alignment Tolerance±3mil 
Silkscreen Alignment Tolerance±6mil 
Silkscreen Line Width5mil 
Gold PlatingNickel : 100u” – 200u”Gold : 1u”-4u” 
Immersion Nickel / GoldNickel : 100u” – 200u”Gold : 1u”-5u” 
Immersion SilverSilver : 6u” – 12u” 
OSPFilm : 8u” – 20u” 
Test VoltageTesting Fixture : 50-300V 
Profile Tolerance of PunchAccurate mould : ±2mil 
Ordinary mould : ±4mil
Knife mould : ±8mil
Hand-Cut : ±15mil

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